Quantum Tech Network

Research & Funding · Open

Superconducting Platform Technologies

This EuroHPC research and innovation call supports superconducting quantum computing platforms with classical computing integration. The work is relevant to the fabrication, packaging, control and low-temperature engineering capabilities needed to assemble a scalable quantum system.

Technical scope

The official notice addresses a superconducting quantum processing unit using chiplet technology, supporting readout and error correction, with cloud accessibility and integration into classical infrastructure. Its objective is a functioning platform rather than a component purchase.\n\nA supplier assessment should consider device fabrication, interconnects, packaging, cryogenic operation and control electronics in the context of a larger architecture. The funding action may create research collaboration opportunities, but individual organizations must review eligibility and the detailed proposal conditions. Technical relevance and funding eligibility are different questions.

Relevant organizations and applications

Superconducting quantum-hardware developers, research institutes, semiconductor fabrication and packaging teams, low-temperature engineering specialists and organizations supporting control and classical-computing integration.

Eligibility

Participation is limited to legal entities established in EU Member States or participating states of EuroHPC JU. Entities in Horizon Europe associated countries that become EuroHPC participants before grant signature may also be eligible. Direct or indirect control by a non-eligible country or entity brings additional restrictions unless approved guarantees protect EU strategic interests. Horizon Europe General Annex conditions, including admissibility and financial and operational capacity, also apply. Review the complete official topic conditions and application forms before determining whether a particular organization or consortium can apply.

Relevance to technology suppliers

Fabrication, packaging, measurement and low-temperature capabilities may be relevant to the research scope. Suppliers should distinguish participation in platform development from a later competitive procurement of components or services.

Related technology areas

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